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Polyimide Film
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Polyimide Film Property |
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Polyimide Film is synthesized by the polycondensation of
aromatic dianhydride and aromatic diamine (PMDA and
ODA
). It shows outstanding physical , thermal, electrical,
and chemical properties over a wide range of temperature
as low as -452F(-269C) and as high as 500F(+260C).It also offers good
dimensional stability and can be die-cut, laminated, metallized, formed, thermoformed or adhesive coated. |
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Polyimide Film Applications |
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Polyimide Film Specifications |
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Density :
1.42+/-0.02 g/cm3 |
Tensile Strength : 135 MPa (MD), 115 MPa
(TD)
Elongation : 35 %
Shrinkage : 1.0 % (150℃), 3.0 % (400C)
Breakdown Strength : 150 MV/m (50HZ)
Surface Resistivity : 1.0x10e13 Ω (200C)
Volume Resistivity : 1.0x10e10 Ω (200C)
Dielectric Constant : 3.5+/-0.4 (50HZ)
Loss Tangent : 4.0x10e-3 (48~62HZ) |
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Available |
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Width : From 6mm to 1000mm |
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Thickness Varied : 0.025,
0.030,0.050, 0.075, 0.080,0.100,0.125mm |
Core (ID) : 76mm ,152mm (Paper or
Plastic)
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